General market existing IGBT heat pipe heat sink mainly these kinds, such as heat sink fin, heat pipe and base, wherein the base is provided with a number of grooves, the grooves is then welded with solder to the evaporating section of the heat pipe
In the existing heat pipe technology for IGBT heat sink , the evaporating section of the heat pipe is buried in the base groove and does not directly fit with the base of IGBT. During the working process, the heat on the surface of IGBT is firstly exported through the base, and then transferred to the heat pipe and heat sink fin. Finally, the heat is transferred to the air by convection through theheat sink fin.
Because base itself has thermal resistance, and the thermal conductivity of the heat pipe is far greater than that of the base, the heat pipe heat sink thermal efficiency improvement is limited, heat dissipation performance is reduced. In addition, in the existing technology, the heat pipe evaporation section and the base groove welding connection, the contact resistance is larger, the processing technology requirements are higher.
As the heating power of IGBT devices in various fields becomes larger and larger, the technical requirements of the manufacturers of heat pipe heat sink become higher and higher, and technical updates are needed to meet higher and higher cooling needs. LORI has a professional r&d and design team, which is dedicated to developing more professional and efficient cooling technology and providing better cooling solutions, so that it can grow in the fierce market competition
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